Method for detecting a differential fault analysis attack and a thinning of the substrate in an integrated circuit, and associated integrated circuit
Abstract:
An integrated circuit includes a semiconductor substrate having a rear face. A first semiconductor well within the substrate includes circuit components. A second semiconductor well within the substrate is insulated from the first semiconductor well and the rest of the substrate. The second semiconductor well provides a detection device that is configurable and designed to detect a DFA attack by fault injection into the integrated circuit.
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