Invention Grant
- Patent Title: Method for detecting a differential fault analysis attack and a thinning of the substrate in an integrated circuit, and associated integrated circuit
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Application No.: US17091466Application Date: 2020-11-06
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Publication No.: US11942440B2Publication Date: 2024-03-26
- Inventor: Alexandre Sarafianos , Abderrezak Marzaki
- Applicant: STMicroelectronics (Rousset) SAS
- Applicant Address: FR Rousset
- Assignee: STMicroelectronics (Rousset) SAS
- Current Assignee: STMicroelectronics (Rousset) SAS
- Current Assignee Address: FR Rousset
- Agency: CROWE & DUNLEVY
- Priority: FR 59519 2017.10.11
- Main IPC: H01L23/00
- IPC: H01L23/00 ; G06F21/55 ; G06F21/78 ; G06F21/87 ; H01L29/06 ; H04L9/00

Abstract:
An integrated circuit includes a semiconductor substrate having a rear face. A first semiconductor well within the substrate includes circuit components. A second semiconductor well within the substrate is insulated from the first semiconductor well and the rest of the substrate. The second semiconductor well provides a detection device that is configurable and designed to detect a DFA attack by fault injection into the integrated circuit.
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