Invention Grant
- Patent Title: Semiconductor device and manufacturing method thereof
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Application No.: US17366530Application Date: 2021-07-02
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Publication No.: US11942479B2Publication Date: 2024-03-26
- Inventor: Yu-Lien Huang
- Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Applicant Address: TW Hsinchu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Current Assignee Address: TW Hsinchu
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Main IPC: H01L21/76
- IPC: H01L21/76 ; H01L21/8234 ; H01L27/092 ; H01L29/06 ; H01L29/66 ; H01L29/78

Abstract:
A device includes a channel layer, a gate structure, a source/drain epitaxial structure, and a gate via. The gate structure wraps around the channel layer. The gate structure includes a gate dielectric layer and a gate electrode over the gate dielectric layer. The source/drain epitaxial structure is adjacent the gate structure and is electrically connected to the channel layer. The gate via is under the gate structure and is in contact with a bottom surface of the gate electrode.
Public/Granted literature
- US20220310603A1 SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF Public/Granted day:2022-09-29
Information query
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