Invention Grant
- Patent Title: Solid-state image pickup apparatus and image pickup system
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Application No.: US18184471Application Date: 2023-03-15
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Publication No.: US11942501B2Publication Date: 2024-03-26
- Inventor: Nobuyuki Endo , Tetsuya Itano , Kazuo Yamazaki , Kyouhei Watanabe , Takeshi Ichikawa
- Applicant: CANON KABUSHIKI KAISHA
- Applicant Address: JP Tokyo
- Assignee: Canon Kabushiki Kaisha
- Current Assignee: Canon Kabushiki Kaisha
- Current Assignee Address: JP Tokyo
- Agency: Canon U.S.A., Inc. IP Division
- Priority: WO TJP2009071703 2009.12.26
- Main IPC: H01L27/146
- IPC: H01L27/146 ; H01L31/02 ; H04N25/76 ; H04N25/767
Abstract:
An apparatus according to the present invention in which a first substrate including a photoelectric conversion element and a gate electrode of a transistor, and a second substrate including a peripheral circuit portion are placed upon each other. The first substrate does not include a high-melting-metal compound layer, and the second substrate includes a high-melting-metal compound layer.
Public/Granted literature
- US20230215894A1 SOLID-STATE IMAGE PICKUP APPARATUS AND IMAGE PICKUP SYSTEM Public/Granted day:2023-07-06
Information query
IPC分类:
