Invention Grant
- Patent Title: Semiconductor structure and method of fabricating the semiconductor structure
-
Application No.: US17571941Application Date: 2022-01-10
-
Publication No.: US11942513B2Publication Date: 2024-03-26
- Inventor: Guan-Lin Chen , Kuo-Cheng Chiang , Chih-Hao Wang , Shi Ning Ju , Jui-Chien Huang
- Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
- Applicant Address: TW Hsinchu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
- Current Assignee Address: TW Hsinchu
- Agency: WPAT LAW
- Agent Anthony King
- Main IPC: H01L29/06
- IPC: H01L29/06 ; H01L21/02 ; H01L21/265 ; H01L21/306 ; H01L21/3105 ; H01L21/762 ; H01L29/08 ; H01L29/10 ; H01L29/423 ; H01L29/66 ; H01L29/78

Abstract:
The present disclosure provides a semiconductor structure, including a substrate having a front surface, a first semiconductor layer proximal to the front surface, a second semiconductor layer over the first semiconductor layer, a gate having a portion between the first semiconductor layer and the second semiconductor layer, a spacer between the first semiconductor layer and the second semiconductor layer, contacting the gate, and a source/drain (S/D) region, wherein the S/D region is in direct contact with a bottom surface of the second semiconductor layer, and the spacer has an upper surface interfacing with the second semiconductor layer, the upper surface including a first section proximal to the S/D region, a second section proximal to the gate, and a third section between the first section and the second section.
Public/Granted literature
- US20220130958A1 SEMICONDUCTOR STRUCTURE AND METHOD OF FABRICATING THE SEMICONDUCTOR STRUCTURE Public/Granted day:2022-04-28
Information query
IPC分类: