Invention Grant
- Patent Title: Semiconductor devices and methods of forming the same
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Application No.: US18168422Application Date: 2023-02-13
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Publication No.: US11942523B2Publication Date: 2024-03-26
- Inventor: Sai-Hooi Yeong , Pei-Yu Wang , Chi On Chui
- Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
- Applicant Address: TW Hsinchu
- Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee Address: TW Hsinchu
- Agency: Slater Matsil, LLP
- Main IPC: H01L29/417
- IPC: H01L29/417 ; H01L21/306 ; H01L21/3065 ; H01L21/8238 ; H01L27/092 ; H01L29/06 ; H01L29/08 ; H01L29/423 ; H01L29/66 ; H01L29/775 ; H01L29/78 ; H01L29/786

Abstract:
In an embodiment, a device includes: a first nanostructure over a substrate, the first nanostructure including a channel region and a first lightly doped source/drain region, the first lightly doped source/drain region adjacent the channel region; a first epitaxial source/drain region wrapped around four sides of the first lightly doped source/drain region; an interlayer dielectric over the first epitaxial source/drain region; a source/drain contact extending through the interlayer dielectric, the source/drain contact wrapped around four sides of the first epitaxial source/drain region; and a gate stack adjacent the source/drain contact and the first epitaxial source/drain region, the gate stack wrapped around four sides of the channel region.
Public/Granted literature
- US20230197801A1 Semiconductor Devices and Methods of Forming the Same Public/Granted day:2023-06-22
Information query
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