Invention Grant
- Patent Title: Semiconductor devices and methods of manufacturing thereof
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Application No.: US17834614Application Date: 2022-06-07
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Publication No.: US11942529B2Publication Date: 2024-03-26
- Inventor: Shih-Yao Lin , Chih-Han Lin , Hsiao Wen Lee
- Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
- Applicant Address: TW Hsinchu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsinchu
- Agency: Foley & Lardner LLP
- Main IPC: H01L29/423
- IPC: H01L29/423 ; H01L29/06 ; H01L29/66 ; H01L29/78 ; H01L29/786 ; H01L21/3065

Abstract:
A semiconductor device includes a plurality of semiconductor layers vertically separated from one another. Each of the plurality of semiconductor layers extends along a first lateral direction. The semiconductor device includes a gate structure that extends along a second lateral direction and comprises at least a lower portion that wraps around each of the plurality of semiconductor layers. The lower portion of the gate structure comprises a plurality of first gate sections that are laterally aligned with the plurality of semiconductor layers, respectively, and wherein each of the plurality of first gate sections has ends that each extend along the second lateral direction and present a first curvature-based profile.
Public/Granted literature
- US20220302276A1 SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING THEREOF Public/Granted day:2022-09-22
Information query
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