Invention Grant
- Patent Title: Method for fabricating a semiconductor device
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Application No.: US17124692Application Date: 2020-12-17
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Publication No.: US11942553B2Publication Date: 2024-03-26
- Inventor: Jae Kyeong Jeong , Yun Heub Song , Chang Hwan Choi , Hyeon Joo Seul
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR
- Agency: Fish & Richardson P.C.
- Priority: KR 20180072751 2018.06.25
- Main IPC: H01L29/786
- IPC: H01L29/786 ; H01L29/66 ; H10B41/20 ; H10B41/23 ; H10B41/27 ; H10B41/60 ; H10B41/70 ; H10B43/23 ; H10B43/27 ; H10B51/20 ; H10B53/20 ; H10B63/00

Abstract:
The semiconductor device includes a substrate, a stack structure including gate patterns and interlayer insulating films that are alternately stacked on the substrate, an insulating pillar extending in a thickness direction of the substrate within the stack structure, a polycrystalline metal oxide film extending along a sidewall of the insulating pillar between the insulating pillar and the stack structure, a liner film having a transition metal between the insulating pillar and the polycrystalline metal oxide film, and a tunnel insulating film, a charge storage film, and a blocking insulating film which are disposed in order between the polycrystalline metal oxide film and the gate patterns.
Public/Granted literature
- US20210104632A1 METHOD FOR FABRICATING A SEMICONDUCTOR DEVICE Public/Granted day:2021-04-08
Information query
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