Invention Grant
- Patent Title: Light-emitting module and method of manufacturing the same
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Application No.: US18072552Application Date: 2022-11-30
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Publication No.: US11942582B2Publication Date: 2024-03-26
- Inventor: Saiki Yamamoto , Shinya Matsuoka
- Applicant: NICHIA CORPORATION
- Applicant Address: JP Anan
- Assignee: NICHIA CORPORATION
- Current Assignee: NICHIA CORPORATION
- Current Assignee Address: JP Anan
- Agency: MORI & WARD, LLP
- Priority: JP 19082309 2019.04.23
- Main IPC: H01L33/58
- IPC: H01L33/58 ; H01L25/16 ; H01L33/48 ; H01L33/50

Abstract:
A light-emitting module including a substrate, a light-emitting device disposed on the substrate, a lens, and an optical sensor. The light-emitting device includes at least one light-emitting element and a light-transmissive member disposed on a light extraction surface of the at least one light-emitting element. The lens is disposed apart from the light-emitting device at a position where the lens faces the light-emitting device. The optical sensor has an upper surface including a light-receiving surface to receive light through the lens and is disposed on the substrate at a position where at least a part of the light-receiving surface faces the lens. A center of the light-emitting device is located at a center of the lens in a plan view.
Public/Granted literature
- US20230094131A1 LIGHT-EMITTING MODULE AND METHOD OF MANUFACTURING THE SAME Public/Granted day:2023-03-30
Information query
IPC分类: