Invention Grant
- Patent Title: Electrically functional circuit board core material
-
Application No.: US17163648Application Date: 2021-02-01
-
Publication No.: US11943869B2Publication Date: 2024-03-26
- Inventor: Brandon Summey , Peter A. Blais , Robert Andrew Ramsbottom , Jeffrey Poltorak , Courtney Elliott
- Applicant: KEMET Electronics Corporation
- Applicant Address: US FL Fort Lauderdale
- Assignee: KEMET Electronics Corporation
- Current Assignee: KEMET Electronics Corporation
- Current Assignee Address: US FL Fort Lauderdale
- Agency: Patent Filing Specialist Inc.
- Agent Joseph T. Guy
- Main IPC: H05K1/11
- IPC: H05K1/11 ; H01G9/045 ; H05K1/03 ; H05K1/18 ; H05K3/30 ; H05K3/46

Abstract:
An improved circuit board core material, and method of making the circuit board core material, is provided wherein the circuit board core material is particularly suitable for use in a circuit board. The circuit board core material comprises a laminate. The laminate comprises a prepreg layer with a first clad layer on the prepreg layer wherein the prepreg layer comprises a pocket. An electronic component is in the pocket wherein the electronic component comprises a first external termination and a second external termination. The first external termination is laminated to, and in electrical contact with, the first clad layer and said second external termination is in electrical contact with a conductor.
Public/Granted literature
- US20210243897A1 Electrically Functional Circuit Board Core Material Public/Granted day:2021-08-05
Information query