Invention Grant
- Patent Title: Electronic device
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Application No.: US17910197Application Date: 2021-03-23
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Publication No.: US11943898B2Publication Date: 2024-03-26
- Inventor: Nobuyuki Sugawara , Katsushi Ito
- Applicant: Sony Interactive Entertainment Inc.
- Applicant Address: JP Tokyo
- Assignee: Sony Interactive Entertainment Inc.
- Current Assignee: Sony Interactive Entertainment Inc.
- Current Assignee Address: JP Tokyo
- Agent Matthew B. Dernier, Esq.
- Priority: JP 20059185 2020.03.27
- International Application: PCT/JP2021/011967 2021.03.23
- International Announcement: WO2021/193621A 2021.09.30
- Date entered country: 2022-09-08
- Main IPC: H05K7/20
- IPC: H05K7/20 ; H05K9/00

Abstract:
A leakage of electromagnetic waves is suppressed effectively on the periphery of a heat radiating device. A heat radiating device (80) includes a plurality of fins (81) that are arranged on the inside of an opening (52a), a heat pipe (83) that includes a connecting portion (83a) being located between the plurality of fins (81) and a circuit board (50) and extending in a left-right direction along the circuit board (50), and a base plate (82) that supports the plurality of fins (81). The base plate (82) includes a plate left portion (82c). The plate left portion (82c) covers a lower surface of the heat pipe (83), the lower surface facing a side of a board shield (52), and closes a gap (G1) between a left end of the plurality of fins (81) and a left edge of the opening (52a) of the board shield (52).
Public/Granted literature
- US20230097177A1 ELECTRONIC DEVICE Public/Granted day:2023-03-30
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