An RF-shielded window apparatus may include a primary panel and a secondary panel. The primary panel may include a primary RF shield layer disposed between a primary backing substrate and a protective layer. The secondary panel may include a secondary backing substrate and a secondary RF shield layer. The first panel element and the second panel element may be secured to one another such that the primary RF shield layer, the secondary RF shield layer and the protective layer are collectively disposed between the primary backing substrate and the secondary backing substrate. The primary RF shield layer and the secondary RF shield layer may be in electrically-conductive communication with one another. A panel joining strip may help secure the first panel to the second panel, and the electrically-conductive communication may be at least in part by way of the panel joining strip. Associated manufacturing methods are also disclosed.