Invention Grant
- Patent Title: DRAM with buried gate structure
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Application No.: US16102715Application Date: 2018-08-13
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Publication No.: US11943911B2Publication Date: 2024-03-26
- Inventor: Yukihiro Nagai
- Applicant: UNITED MICROELECTRONICS CORP. , Fujian Jinhua Integrated Circuit Co., Ltd.
- Applicant Address: TW Hsin-Chu
- Assignee: UNITED MICROELECTRONICS CORP.,Fujian Jinhua Integrated Circuit Co., Ltd.
- Current Assignee: UNITED MICROELECTRONICS CORP.,Fujian Jinhua Integrated Circuit Co., Ltd.
- Current Assignee Address: TW Hsin-Chu; CN Quanzhou
- Agent Winston Hsu
- Priority: CN 1710116628.1 2017.03.01
- The original application number of the division: US15465580 2017.03.21
- Main IPC: H10B12/00
- IPC: H10B12/00

Abstract:
A semiconductor structure for a memory device includes a substrate including a memory cell region and a peripheral circuit region defined thereon, at least an active region formed in the peripheral circuit region, a buried gate structure formed in the active region in the peripheral circuit region, a conductive line structure formed on the buried gate structure, and at least a bit line contact plug formed in the memory cell region.
Public/Granted literature
- US20180358363A1 SEMICONDUCTOR STRUCTURE, SEMICONDUCTOR STRUCTURE FOR MEMORY DEVICE AND METHOD FOR FORMING THE SAME Public/Granted day:2018-12-13
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