Invention Grant
- Patent Title: Light-emitting device including a light-transmitting interconnect located over a substrate
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Application No.: US18083118Application Date: 2022-12-16
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Publication No.: US11943964B2Publication Date: 2024-03-26
- Inventor: Junji Taguchi , Hiroki Tan , Noriaki Waki , Masaki Takahashi
- Applicant: PIONEER CORPORATION , TOHOKU PIONEER CORPORATION
- Applicant Address: JP Tokyo
- Assignee: PIONEER CORPORATION,TOHOKU PIONEER CORPORATION
- Current Assignee: PIONEER CORPORATION,TOHOKU PIONEER CORPORATION
- Current Assignee Address: JP Tokyo; JP Yamagata
- Agency: Procopio, Cory, Hargreaves & Savitch LLP
- Main IPC: H10K50/858
- IPC: H10K50/858 ; H05B33/22 ; H05B33/28 ; H10K50/00 ; H10K50/81 ; H10K50/813 ; H10K50/828 ; H10K59/173 ; H10K77/10 ; H10K102/00 ; H10K102/10
Abstract:
A light-emitting device includes a light-transmitting substrate, a light-transmitting interconnect located over the substrate, an insulating layer located over the substrate and the interconnect, and an intermediate layer formed in at least a region of a lateral side of the interconnect that overlaps the insulating layer.
Public/Granted literature
- US20230121632A1 LIGHT-EMITTING DEVICE INCLUDING A LIGHT-TRANSMITTING INTERCONNECT LOCATED OVER A SUBSTRATE Public/Granted day:2023-04-20
Information query
