Invention Grant
- Patent Title: Synthetic grindstone, synthetic grindstone assembly, and manufacturing method of synthetic grindstone
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Application No.: US18318979Application Date: 2023-05-17
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Publication No.: US11945077B1Publication Date: 2024-04-02
- Inventor: Kai Kyoshima , Takeshi Yagi
- Applicant: TOKYO DIAMOND TOOLS MFG. CO., LTD.
- Applicant Address: JP Tokyo
- Assignee: TOKYO DIAMOND TOOLS MFG. CO., LTD.
- Current Assignee: TOKYO DIAMOND TOOLS MFG. CO., LTD.
- Current Assignee Address: JP Tokyo
- Agency: Scully, Scott, Murphy & Presser, P.C.
- Priority: JP 22152940 2022.09.26
- Main IPC: B24D5/02
- IPC: B24D5/02 ; B24D18/00
Abstract:
A synthetic grindstone for performing surface processing, includes: abrasive grains; binder made of a thermosetting resin material and holding the abrasive grains in a dispersed state; and filler including at least one of first filler, second filler, and third filler. The first filler has a larger average particle diameter than the abrasive grains. The second filler has electrical conductivity. The third filler is harder than a workpiece. The filler is disposed in a state of being dispersed in the binder.
Public/Granted literature
- US20240100654A1 SYNTHETIC GRINDSTONE, SYNTHETIC GRINDSTONE ASSEMBLY, AND MANUFACTURING METHOD OF SYNTHETIC GRINDSTONE Public/Granted day:2024-03-28
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