Invention Grant
- Patent Title: Method and device for molding laminate
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Application No.: US17425640Application Date: 2019-12-26
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Publication No.: US11945179B2Publication Date: 2024-04-02
- Inventor: Toshiki Kitazawa , Homare Yamato , Masahiko Shimizu , Hiromichi Akiyama , Akihiro Terasaka
- Applicant: MITSUBISHI HEAVY INDUSTRIES, LTD.
- Applicant Address: JP Tokyo
- Assignee: MITSUBISHI HEAVY INDUSTRIES, LTD.
- Current Assignee: MITSUBISHI HEAVY INDUSTRIES, LTD.
- Current Assignee Address: JP Tokyo
- Agent Manabu Kanesaka; Benjamin Hauptman; Kenneth Berner
- Priority: JP 19020754 2019.02.07
- International Application: PCT/JP2019/051217 2019.12.26
- International Announcement: WO2020/162077A 2020.08.13
- Date entered country: 2021-07-23
- Main IPC: B29C70/28
- IPC: B29C70/28 ; B29C70/30 ; B29C70/54 ; B32B5/26 ; B32B7/08 ; B32B37/00 ; B32B38/00 ; B32B38/18 ; B29L31/30 ; B64C1/00 ; B64C1/06

Abstract:
The preset invention is to mold a laminate at a high accuracy by appropriately generating slippage between fiber sheets of the laminate at bending. A method for molding a laminate includes a step in which a plurality of gripping parts, which are arranged apart from each other, grip an area, wherein slippage between fiber sheets is prevented, in a plate-shaped laminate including a plurality of fiber sheets laminated each other; a step in which the plurality of gripping parts grip the area wherein slippage between the fiber sheets is prevented, while maintaining the state wherein relative moving of the area of the laminate and the gripping parts is prevented; and a step in which the gripping parts move so as to subject the laminate to bending.
Public/Granted literature
- US20220097322A1 METHOD AND DEVICE FOR MOLDING LAMINATE Public/Granted day:2022-03-31
Information query