Invention Grant
- Patent Title: Ejection control using substrate alignment features and print region alignment features
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Application No.: US18179703Application Date: 2023-03-07
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Publication No.: US11945219B2Publication Date: 2024-04-02
- Inventor: Christopher R. Hauf , Eli Vronsky , Alexander Sou-Kang Ko
- Applicant: Kateeva, Inc.
- Applicant Address: US CA Newark
- Assignee: Kateeva, Inc.
- Current Assignee: Kateeva, Inc.
- Current Assignee Address: US CA Newark
- Agency: Hauptman Ham, LLP
- Main IPC: B41J2/045
- IPC: B41J2/045

Abstract:
In a printing method, at least one image of a substrate supported in a printing system is acquired. An actual position of a first alignment feature on the substrate in a frame of reference of the printing system is determined based on the at least one image. Expected positions of second alignment features on the substrate are determined based on the actual position of the first alignment feature. Actual positions of the second alignment features in the frame of reference of the printing system are determined based on the at least one image and the expected positions of the second alignment features. Target positions of print regions on the substrate are determined based on the actual positions of the second alignment features. Ejection of print material onto the substrate in the print regions is controlled based on the target positions of the print regions.
Public/Granted literature
- US20230202163A1 EJECTION CONTROL USING SUBSTRATE ALIGNMENT FEATURES AND PRINT REGION ALIGNMENT FEATURES Public/Granted day:2023-06-29
Information query
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