Invention Grant
- Patent Title: General platform for processing workpiece
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Application No.: US17574210Application Date: 2022-01-12
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Publication No.: US11945658B2Publication Date: 2024-04-02
- Inventor: Jian Cao , Lvhai (Samuel) Hu , Dandan (Emily) Zhang , Fengchun (Fred) Xie , An (Joshua) Yang , Yun (Shanghai) Liu , Wenhe Ma , Peng Ji , Zongjie (Jason) Tao , Roberto Francisco-Yi Lu , Tao Xu
- Applicant: Tyco Electronics (Shanghai) Co. Ltd , Tyco Electronics (Qingdao) Ltd. , TE Connectivity Services GmbH
- Applicant Address: CN Shanghai
- Assignee: TE Connectivity Solutions GmbH,Tyco Electronics (Shanghai) Co., Ltd.,Tyco Electronics (Qingdao) Ltd.
- Current Assignee: TE Connectivity Solutions GmbH,Tyco Electronics (Shanghai) Co., Ltd.,Tyco Electronics (Qingdao) Ltd.
- Current Assignee Address: CH Schaffhausen; CN Shanghai; CN Qingdao
- Agency: Barley Snyder
- Priority: CN 2110039481.7 2021.01.12
- Main IPC: B65G47/46
- IPC: B65G47/46

Abstract:
A platform for processing a workpiece includes a transmission mechanism, a plurality of workstations and a plurality of movable vehicles. The transmission mechanism transports the workpiece to be processed to one of the plurality of workstations. Each movable vehicle includes a processing module and a docking interface adapted to connect with a docking station of each workstation. The movable vehicles are each adapted to move in and out of each workstation, and each processing module is adapted to process the workpiece transmitted to the workstation after the movable vehicle is moved in and positioned in the workstation.
Public/Granted literature
- US20220219912A1 General Platform For Processing Workpiece Public/Granted day:2022-07-14
Information query
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