Invention Grant
- Patent Title: Cured resin formation method and cured resin formation device
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Application No.: US17630850Application Date: 2019-07-31
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Publication No.: US11945886B2Publication Date: 2024-04-02
- Inventor: Tasuku Takeuchi , Ryojiro Tominaga
- Applicant: FUJI CORPORATION
- Applicant Address: JP Chiryu
- Assignee: FUJI CORPORATION
- Current Assignee: FUJI CORPORATION
- Current Assignee Address: JP Chiryu
- Agency: Oblon, McClelland, Maier & Neustadt, L.L.P.
- International Application: PCT/JP2019/029992 2019.07.31
- International Announcement: WO2021/019718A 2021.02.04
- Date entered country: 2022-01-27
- Main IPC: C08F2/48
- IPC: C08F2/48

Abstract:
A cured resin formation method including an applying step of applying an ultraviolet curable resin on a base; and a curing step of curing the ultraviolet curable resin by irradiating the ultraviolet curable resin applied in the applying step with ultraviolet rays, in which in the curing step, the ultraviolet curable resin is irradiated with ultraviolet rays while cooling the ultraviolet curable resin, so that a difference between an ordinary temperature of the ultraviolet curable resin and a temperature of the ultraviolet curable resin when irradiated with ultraviolet rays is within a set temperature difference set in advance.
Public/Granted literature
- US20220298267A1 CURED RESIN FORMATION METHOD AND CURED RESIN FORMATION DEVICE Public/Granted day:2022-09-22
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