Invention Grant
- Patent Title: Curable composition
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Application No.: US17038491Application Date: 2020-09-30
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Publication No.: US11945893B2Publication Date: 2024-04-02
- Inventor: Fen Wan , Weijun Liu , Gary F. Doyle
- Applicant: CANON KABUSHIKI KAISHA
- Applicant Address: JP Tokyo
- Assignee: CANON KABUSHIKI KAISHA
- Current Assignee: CANON KABUSHIKI KAISHA
- Current Assignee Address: JP Tokyo
- Agency: Abel Schillinger, LLP
- Main IPC: C08F222/10
- IPC: C08F222/10 ; B82Y40/00 ; C08F2/50 ; C08F220/18 ; C08F236/20 ; C08F236/22 ; G03F7/00
Abstract:
A curable composition can comprise a polymerizable material including a monomer of Formula (1), with R being H or alkyl or alkylaryl, n being 1-4, m being 0-6, X1 being C1-C6 substituted or unsubstituted alkyl, X2 being CH3 or H,
After forming a cured layer of the curable composition, the cured layer can have an excellent etch resistance.
After forming a cured layer of the curable composition, the cured layer can have an excellent etch resistance.
Public/Granted literature
- US20220098345A1 CURABLE COMPOSITION Public/Granted day:2022-03-31
Information query
IPC分类:
