The disclosure provides a thermosetting polyimide resin and a manufacturing method thereof, a composition, a prepolymer, a film, an adhesive, and a use thereof. The composition includes at least: (a) a maleimide compound and (b) the thermosetting polyimide resin. The disclosure provides the thermosetting polyimide resin and the prepolymer, for manufacturing a film, an adhesive sheet, a cover film, a redistribution layer, a build-up board, a prepreg sheet, a high-frequency substrate, an integrated circuits carrier board, an adhesive for copper foil, a semiconductor packaging material, a radome, a substrate for server, a substrate for base station, a substrate for vehicle, etc.