Invention Grant
- Patent Title: Thick polyimide film having improved surface quality and method of manufacturing same
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Application No.: US17276188Application Date: 2018-11-22
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Publication No.: US11945922B2Publication Date: 2024-04-02
- Inventor: Won Ho Son , Hyong Sop Jo
- Applicant: PI ADVANCED MATERIALS CO., LTD.
- Applicant Address: KR Chungcheongbuk-do
- Assignee: PI ADVANCED MATERIALS CO., LTD.
- Current Assignee: PI ADVANCED MATERIALS CO., LTD.
- Current Assignee Address: KR Chungcheongbuk-do
- Agency: Harness, Dickey & Pierce, P.L.C.
- Priority: KR 20180125122 2018.10.19
- International Application: PCT/KR2018/014445 2018.11.22
- International Announcement: WO2020/080598A 2020.04.23
- Date entered country: 2021-03-15
- Main IPC: C08J5/18
- IPC: C08J5/18 ; C08G73/10 ; C08L79/08 ; C09J7/10 ; C09J179/08
Abstract:
The present invention provides a polyimide film in which a parameter A for the relationship of the viscosity (V) of a polyamic acid solution, the number average molecular weight (Mn) of polyamic acid, and the thickness (T) of a polyimide film falls within a range from 0.4 to 1.13.
Public/Granted literature
- US20220033597A1 THICK POLYIMIDE FILM HAVING IMPROVED SURFACE QUALITY AND METHOD OF MANUFACTURING SAME Public/Granted day:2022-02-03
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