Invention Grant
- Patent Title: Styrene-based materials for hot melt adhesives
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Application No.: US16486880Application Date: 2018-02-20
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Publication No.: US11945977B2Publication Date: 2024-04-02
- Inventor: Steven D. Gray , Darius K. Deak , Brian R. Minix , Edward P. Tomlinson
- Applicant: BOSTIK, INC.
- Applicant Address: US WI Wauwatosa
- Assignee: Bostik, Inc.
- Current Assignee: Bostik, Inc.
- Current Assignee Address: US WI Wauwatosa
- Agent Christopher R. Lewis
- International Application: PCT/US2018/018826 2018.02.20
- International Announcement: WO2018/152531A 2018.08.23
- Date entered country: 2019-08-19
- Main IPC: C09J153/02
- IPC: C09J153/02 ; C08K3/34 ; C08K3/36 ; C08K5/00 ; C08L25/06 ; C09J11/06 ; C09J125/06

Abstract:
A hot melt adhesive comprises at least one polymer selected from the group consisting of polystyrene, polybutene, polyisobutene, linear low density polyethylene, polypropylene random copolymer, polypropylene, olefin block copolymer, polyolefins, styrene block copolymers, and ethyl vinyl acetate polymers; a tackifying resin; and at least one precisely end-capped polystyrene (PECPS). The use of the styrene-based oligomers and polymers with the precisely controlled end-groups in hot melt adhesive formulations to improve compatibility with polymers and block copolymers frequently used in such adhesives.
Public/Granted literature
- US20200010743A1 STYRENE-BASED MATERIALS FOR HOT MELT ADHESIVES Public/Granted day:2020-01-09
Information query
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