Invention Grant
- Patent Title: Copper or copper alloy electroplating bath
-
Application No.: US17427515Application Date: 2020-01-16
-
Publication No.: US11946153B2Publication Date: 2024-04-02
- Inventor: Masaru Hatabe , Hironori Murakami , Fuka Yamaoka
- Applicant: ISHIHARA CHEMICAL CO., LTD.
- Applicant Address: JP Kobe
- Assignee: ISHIHARA CHEMICAL CO., LTD.
- Current Assignee: ISHIHARA CHEMICAL CO., LTD.
- Current Assignee Address: JP Kobe
- Agency: Knobbe, Martens, Olson & Bear LLP
- Priority: JP 19017033 2019.02.01 JP 20002514 2020.01.10
- International Application: PCT/JP2020/001294 2020.01.16
- International Announcement: WO2020/158418A 2020.08.06
- Date entered country: 2021-07-30
- Main IPC: C25D3/38
- IPC: C25D3/38 ; C25D3/58 ; C25D7/12
Abstract:
A copper or copper alloy electroplating bath has two or more electrolytes. The two or more electrolytes include at least one selected from nitric acid and a nitrate. The two or more electrolytes can form electrodeposits, such as a group of high-aspect bump electrodes, that have a uniform height or thickness at high speed.
Public/Granted literature
- US20220127741A1 COPPER OR COPPER ALLOY ELECTROPLATING BATH Public/Granted day:2022-04-28
Information query
