Invention Grant
- Patent Title: Dielectric material, device comprising dielectric material, and method of preparing dielectric material
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Application No.: US17126902Application Date: 2020-12-18
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Publication No.: US11946154B2Publication Date: 2024-04-02
- Inventor: Hyungjun Kim , Chan Kwak , Takayoshi Sasaki , Yasuo Ebina , Changsoo Lee , Dohwon Jung , Giyoung Jo , Takaaki Taniguchi
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Suwon-si
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Gyeonggi-do
- Agency: Harness, Dickey & Pierce, P.L.C.
- Priority: KR 20190178510 2019.12.30
- Main IPC: C03C17/23
- IPC: C03C17/23 ; C03C17/00 ; C30B1/02

Abstract:
Provided are a dielectric material, a device including the dielectric material, and a method of preparing the dielectric material, in which the dielectric material may include: a layered perovskite compound, wherein the layered perovskite compound may include at least one selected from a Dion-Jacobson phase, an Aurivillius phase, and a Ruddlesden-Popper phase, a temperature coefficient of capacitance (TCC) of a capacitance at 200° C. with respect to a capacitance at 40° C. may be in a range of about −15 percent (%) to about 15%, and a permittivity of the dielectric material may be 200 or greater in a range of about 1 kilohertz (kHz) to about 1 megahertz (MHz).
Public/Granted literature
- US20210198801A1 DIELECTRIC MATERIAL, DEVICE COMPRISING DIELECTRIC MATERIAL, AND METHOD OF PREPARING DIELECTRIC MATERIAL Public/Granted day:2021-07-01
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