• Patent Title: Heat pump system and control method
  • Application No.: US16767855
    Application Date: 2019-07-15
  • Publication No.: US11946671B2
    Publication Date: 2024-04-02
  • Inventor: Zhicheng HuangZhonghui Li
  • Applicant: ECOER INC.
  • Applicant Address: US VA Fairfax
  • Assignee: ECOER INC.
  • Current Assignee: ECOER INC.
  • Current Assignee Address: US VA Fairfax
  • Agent John Ye
  • International Application: PCT/US2019/041785 2019.07.15
  • International Announcement: WO2021/010956A 2021.01.21
  • Date entered country: 2020-05-28
  • Main IPC: F25B13/00
  • IPC: F25B13/00
Heat pump system and control method
Abstract:
The present disclosure relates to the field of air conditioning technology. In particular, it involves a heat pump system and control method.
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