Invention Grant
- Patent Title: Secure identification of wafer and chip
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Application No.: US17485999Application Date: 2021-09-27
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Publication No.: US11947712B2Publication Date: 2024-04-02
- Inventor: Richard C. Johnson , Alex Richard Hubbard , Vinay Pai , Cody J. Murray , Fee Li Lie , Nikhil Jain
- Applicant: International Business Machines Corporation
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agent Donald J. O'Brien
- Main IPC: H04L29/00
- IPC: H04L29/00 ; G06F21/73

Abstract:
Embodiments are disclosed for a method. The method includes generating a correction datastore indicating shifts in magnitude representing corresponding characters that uniquely identify hardware comprising a computer processing chip. The method further includes generating security masks based on a correction file. Additionally, the method includes using a correction process for the computer processing chip. The generated security masks include corresponding overlays representing the shifts in magnitude with respect to corresponding product masks for the computer processing chip. The method also includes generating the computer processing chip using the security masks and the product masks.
Public/Granted literature
- US20230094707A1 SECURE IDENTIFICATION OF WAFER AND CHIP Public/Granted day:2023-03-30
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