Invention Grant
- Patent Title: Fuse delay of a command in a memory package
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Application No.: US17381057Application Date: 2021-07-20
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Publication No.: US11948660B2Publication Date: 2024-04-02
- Inventor: Christopher G. Wieduwilt , Lawrence D. Smith , James S. Rehmeyer
- Applicant: Micron Technology, Inc.
- Applicant Address: US ID Boise
- Assignee: Micron Technology, Inc.
- Current Assignee: Micron Technology, Inc.
- Current Assignee Address: US ID Boise
- Agency: Brooks, Cameron & Huebsch, PLLC
- Main IPC: G11C7/22
- IPC: G11C7/22 ; G11C7/10 ; G11C17/16
Abstract:
Fuses can store different delay states to cause execution of a command to be staggered for different memory dies of a memory package. Fuse arrays can be included in the memory package and programmed to cause execution of a command to be delayed by different amounts for different dies. The fuse arrays can be fabricated and then programmed to cause different delays for different dies.
Public/Granted literature
- US20230026202A1 FUSE DELAY OF A COMMAND IN A MEMORY PACKAGE Public/Granted day:2023-01-26
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