Invention Grant
- Patent Title: Processes, systems and devices for metal filling of high temperature superconductor cables
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Application No.: US17291120Application Date: 2020-11-12
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Publication No.: US11948704B2Publication Date: 2024-04-02
- Inventor: Amanda Hubbard , James Irby , Rui Vieira , William Beck , Richard Murray , Andrew Pfeiffer , Thomas Toland , William Burke
- Applicant: Massachusetts Institute of Technology
- Applicant Address: US MA Cambridge
- Assignee: Massachusetts Institute of Technology
- Current Assignee: Massachusetts Institute of Technology
- Current Assignee Address: US MA Cambridge
- Agency: Daly, Crowley, Mofford & Durkee LLP
- International Application: PCT/US2020/060170 2020.11.12
- International Announcement: WO2021/097049A 2021.05.20
- Date entered country: 2021-05-04
- Main IPC: H01B13/30
- IPC: H01B13/30 ; H01B12/02
Abstract:
Techniques described herein relate to systems and methods for obtaining a high temperature superconducting (HTS) cable assembly and filling the HTS cable assembly with a molten metal, such as solder.
Public/Granted literature
- US20220013256A1 PROCESSES, SYSTEMS AND DEVICES FOR METAL FILLING OF HIGH TEMPERATURE SUPERCONDUCTOR CABLES Public/Granted day:2022-01-13
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