Invention Grant
- Patent Title: Universal microreplicated dielectric insulation for electrical cables
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Application No.: US17259871Application Date: 2019-07-15
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Publication No.: US11948706B2Publication Date: 2024-04-02
- Inventor: Douglas B. Gundel
- Applicant: 3M INNOVATIVE PROPERTIES COMPANY
- Applicant Address: US MN St. Paul
- Assignee: 3M INNOVATIVE PROPERTIES COMPANY
- Current Assignee: 3M INNOVATIVE PROPERTIES COMPANY
- Current Assignee Address: US MN St. Paul
- Agent Jonathan L. Tolstedt
- International Application: PCT/IB2019/056029 2019.07.15
- International Announcement: WO2020/016751A 2020.01.23
- Date entered country: 2021-01-12
- Main IPC: H01B7/08
- IPC: H01B7/08

Abstract:
A ribbon cable is described, including a first insulative layer extending along a length and a width of the cable, and a plurality of spaced apart substantially parallel conductors extending along the length of the cable. The insulative layer has opposing top and bottom major surfaces and defines a plurality of spaced apart cavities extending between the top and bottom major surfaces of the first insulative layer. The top major surface of the first insulative layer is deformed in a plurality of spaced apart substantially parallel regions extending along the length, and arranged along the width, of the cable. Each deformed region has a shape of a groove and includes a deformed portion of at least one cavity in the plurality of cavities. Each conductor is disposed within a corresponding deformed region of the insulative layer.
Public/Granted literature
- US20210343449A1 UNIVERSAL MICROREPLICATED DIELECTRIC INSULATION FOR ELECTRICAL CABLES Public/Granted day:2021-11-04
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