Invention Grant
- Patent Title: Packaged isolation barrier with integrated magnetics
-
Application No.: US16883614Application Date: 2020-05-26
-
Publication No.: US11948721B2Publication Date: 2024-04-02
- Inventor: Ying-Chuan Kao , Hung-Yu Chou , Dong-Ren Peng , Jun Jie Kuo , Kenji Otake , Chih-Chien Ho
- Applicant: TEXAS INSTRUMENTS INCORPORATED
- Applicant Address: US TX Dallas
- Assignee: TEXAS INSTRUMENTS INCORPORATED
- Current Assignee: TEXAS INSTRUMENTS INCORPORATED
- Current Assignee Address: US TX Dallas
- Agent Ronald O. Neerings; Frank D. Cimino
- Main IPC: H01F27/28
- IPC: H01F27/28 ; H01F19/08 ; H01L23/64 ; H01L49/02

Abstract:
An apparatus includes a laminate, the laminate including a dielectric layer having a first surface and a second surface opposed to the first surface, and a conductive layer forming a circuit element overlying the first surface of the dielectric layer. The apparatus further includes a magnetic layer over the conductive layer. A first edge surface of the magnetic layer is coplanar with a first edge surface of the laminate, and a second edge surface of the magnetic layer is coplanar with a second edge surface of the laminate.
Public/Granted literature
- US20210375525A1 PACKAGED ISOLATION BARRIER WITH INTEGRATED MAGNETICS Public/Granted day:2021-12-02
Information query