Invention Grant
- Patent Title: Semiconductor device and manufacturing method thereof
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Application No.: US17542666Application Date: 2021-12-06
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Publication No.: US11948808B2Publication Date: 2024-04-02
- Inventor: Dong Jin Kim , Jin Han Kim , Won Chul Do , Jae Hun Bae , Won Myoung Ki , Dong Hoon Han , Do Hyung Kim , Ji Hun Lee , Jun Hwan Park , Seung Nam Son , Hyun Cho , Curtis Zwenger
- Applicant: Amkor Technology Singapore Holding Pte. Ltd.
- Applicant Address: SG Singapore
- Assignee: AMKOR TECHNOLOGY SINGAPORE HOLDING PTE. LTD.
- Current Assignee: AMKOR TECHNOLOGY SINGAPORE HOLDING PTE. LTD.
- Current Assignee Address: SG Singapore
- Agency: McAndrews, Held & Malloy, Ltd.
- Priority: KR 20150037481 2015.03.18
- Main IPC: H01L21/48
- IPC: H01L21/48 ; H01L21/683 ; H01L23/00 ; H01L23/498 ; H01L23/538 ; H01L21/56 ; H01L23/31
Abstract:
A method for manufacturing a semiconductor device and a semiconductor device produced thereby. For example and without limitation, various aspects of this disclosure provide a method for manufacturing a semiconductor device, and a semiconductor device produced thereby, that comprises an interposer without through silicon vias.
Public/Granted literature
- US20220165582A1 SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF Public/Granted day:2022-05-26
Information query
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