Invention Grant
- Patent Title: Valve structure and substrate processing apparatus including the same
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Application No.: US17747270Application Date: 2022-05-18
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Publication No.: US11948814B2Publication Date: 2024-04-02
- Inventor: Kangmin Park , Hyungho Kim , Dongwoo Wi , Hyunsoo Chun , Jiho Uh
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: Muir Patent Law, PLLC
- Priority: KR 20210144013 2021.10.26
- Main IPC: H01L21/67
- IPC: H01L21/67 ; F16K3/18 ; F16K3/314 ; F16K51/02 ; H01L21/677 ; F16K3/02

Abstract:
A process chamber door for closing or opening an entrance of a process chamber through which a substrate to be process is loaded includes a seal plate including a front surface and a rear surface opposite to each other in a first direction, a connection block connected to the rear surface of the seal plate and including a central portion and two side portions connected to the rear surface of the seal plate, and a shaft connected to the central portion of the connection block. The connection block includes a first hinge groove and a second hinge groove. The first hinge groove is exposed at a bottom surface and a side surface of the connection block and the second hinge groove is exposed at an upper surface and the side surface of the connection block.
Public/Granted literature
- US20230130512A1 VALVE STRUCTURE AND SUBSTRATE PROCESSING APPARATUS INCLUDING THE SAME Public/Granted day:2023-04-27
Information query
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