Invention Grant
- Patent Title: Pin-less substrate transfer apparatus and method for a processing chamber
-
Application No.: US16744478Application Date: 2020-01-16
-
Publication No.: US11948828B2Publication Date: 2024-04-02
- Inventor: Sultan Malik , Srinivas D. Nemani , Adib M. Khan , Qiwei Liang
- Applicant: Applied Materials, Inc.
- Applicant Address: US CA Santa Clara
- Assignee: Applied Materials, Inc.
- Current Assignee: Applied Materials, Inc.
- Current Assignee Address: US CA Santa Clara
- Agency: Patterson + Sheridan, LLP
- Main IPC: H01L21/687
- IPC: H01L21/687 ; H01L21/677

Abstract:
The present disclosure generally relates to a pin-less substrate transfer apparatus and method for a processing chamber. The processing chamber includes a pedestal. The pedestal includes a pedestal plate. The pedestal plate has a radius, a top surface, and a bottom surface. The pedestal plate further includes a plurality of cut outs on a perimeter of the pedestal plate. Flat edges are disposed on opposite sides of the pedestal plate. Recesses are disposed in the bottom surface below each of the flat edges.
Public/Granted literature
- US20210225687A1 PIN-LESS SUBSTRATE TRANSFER APPARATUS AND METHOD FOR A PROCESSING CHAMBER Public/Granted day:2021-07-22
Information query
IPC分类: