Invention Grant
- Patent Title: Semiconductor device package
-
Application No.: US17239483Application Date: 2021-04-23
-
Publication No.: US11948852B2Publication Date: 2024-04-02
- Inventor: Chang-Lin Yeh
- Applicant: Advanced Semiconductor Engineering, Inc.
- Applicant Address: TW Kaohsiung
- Assignee: ADVANCED SEMICONDUTOR ENGINEERING, INC.
- Current Assignee: ADVANCED SEMICONDUTOR ENGINEERING, INC.
- Current Assignee Address: TW Kaohsiung
- Agency: FOLEY & LARDNER LLP
- Main IPC: H01L23/367
- IPC: H01L23/367 ; H01L21/48 ; H01L21/56 ; H01L23/00 ; H01L23/31 ; H01L23/498 ; H01L23/538
Abstract:
The present disclosure provides a semiconductor device package including a first substrate, a second substrate disposed over the first substrate, an electronic component disposed between the first substrate and the second substrate, a spacer disposed between the first substrate and the electronic component, and a supporting element disposed on the first substrate and configured to support the second substrate. The spacer is configured to control a distance between the first substrate and the second substrate through the electronic component. A method of manufacturing a semiconductor device package is also disclosed.
Public/Granted literature
- US20220344234A1 SEMICONDUCTOR DEVICE PACKAGE AND METHOD FOR MANUFACTURING THE SAME Public/Granted day:2022-10-27
Information query
IPC分类:
