Invention Grant
- Patent Title: Electronic device and manufacturing method of electronic device
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Application No.: US17304566Application Date: 2021-06-23
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Publication No.: US11948908B2Publication Date: 2024-04-02
- Inventor: Kazuyuki Yamada
- Applicant: Japan Display Inc.
- Applicant Address: JP Tokyo
- Assignee: Japan Display Inc.
- Current Assignee: Japan Display Inc.
- Current Assignee Address: JP Tokyo
- Agency: Maier & Maier, PLLC
- Priority: JP 20115596 2020.07.03
- Main IPC: H01L23/00
- IPC: H01L23/00 ; H01L25/16

Abstract:
An electronic device comprising: an array substrate having a first electrode and a second electrode; a first connecting member arranged on the first electrode; a first LED chip mounted on the first connecting member; a second connecting member arranged on the second electrode and being thicker than the first connecting member; and a second LED chip mounted on the second connecting member. A distance from a reference surface of the array substrate to a top surface of the second connecting member is larger than a distance from the reference surface to a top surface of the first connecting member.
Public/Granted literature
- US20220005780A1 ELECTRONIC DEVICE AND MANUFACTURING METHOD OF ELECTRONIC DEVICE Public/Granted day:2022-01-06
Information query
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