Invention Grant
- Patent Title: Semiconductor structure and method of manufacturing the same
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Application No.: US17461308Application Date: 2021-08-30
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Publication No.: US11948969B2Publication Date: 2024-04-02
- Inventor: Ming Chyi Liu , Chun-Tsung Kuo
- Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
- Applicant Address: TW Hsinchu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
- Current Assignee Address: TW Hsinchu
- Agency: WPAT LAW
- Agent Anthony King
- Main IPC: H10B12/00
- IPC: H10B12/00 ; H01L49/02

Abstract:
A semiconductor structure includes a substrate, at least one dielectric layer and a capacitor structure. The at least one dielectric layer is disposed over the substrate, and the at least one dielectric layer includes a step edge profile. The capacitor structure is disposed over the substrate. The capacitor structure includes a bottom electrode, a capacitor dielectric layer and a top electrode. The bottom electrode covers the step edge profile of the at least one dielectric layer and has a first step profile substantially conformal to the step edge profile of the at least one dielectric layer. The capacitor dielectric layer covers the bottom electrode and has a second step profile substantially conformal to the first step profile. The top electrode covers the capacitor dielectric layer.
Public/Granted literature
- US20230067299A1 SEMICONDUCTOR STRUCTURE AND METHOD OF MANUFACTURING THE SAME Public/Granted day:2023-03-02
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