Invention Grant
- Patent Title: Semiconductor device including vertical transistor with back side power structure
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Application No.: US17461476Application Date: 2021-08-30
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Publication No.: US11948974B2Publication Date: 2024-04-02
- Inventor: Shih-Wei Peng , Te-Hsin Chiu , Jiann-Tyng Tzeng
- Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Duane Morris LLP
- Main IPC: H01L29/06
- IPC: H01L29/06 ; H01L23/522 ; H01L25/11 ; H01L29/423 ; H01L29/786

Abstract:
A semiconductor device including vertical transistors with a back side power structure, and methods of making the same are described. In one example, a described semiconductor structure includes: a gate structure including a gate pad and a gate contact on the gate pad; a first source region disposed below the gate pad; a first drain region disposed on the gate pad, wherein the first source region, the first drain region and the gate structure form a first transistor; a second source region disposed below the gate pad; a second drain region disposed on the gate pad, wherein the second source region, the second drain region and the gate structure form a second transistor; and at least one metal line that is below the first source region and the second source region, and is electrically connected to at least one power supply.
Public/Granted literature
- US20230069119A1 SEMICONDUCTOR DEVICE INCLUDING VERTICAL TRANSISTOR WITH BACK SIDE POWER STRUCTURE Public/Granted day:2023-03-02
Information query
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