Invention Grant
- Patent Title: Light emitting element structure and method of fabricating a light emitting element
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Application No.: US17290682Application Date: 2019-05-27
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Publication No.: US11949045B2Publication Date: 2024-04-02
- Inventor: Hyun Min Cho , Jung Hong Min , Dae Hyun Kim , Dong Uk Kim , Jae Hoon Jung
- Applicant: Samsung Display Co., Ltd.
- Applicant Address: KR Yongin-si
- Assignee: Samsung Display Co., Ltd.
- Current Assignee: Samsung Display Co., Ltd.
- Current Assignee Address: KR Yongin-si
- Agency: Lewis Roca Rothgerber Christie LLP
- Priority: KR 20180131072 2018.10.30
- International Application: PCT/KR2019/006323 2019.05.27
- International Announcement: WO2020/091171A 2020.05.07
- Date entered country: 2021-04-30
- Main IPC: H01L33/44
- IPC: H01L33/44 ; H01L27/15 ; H01L33/00 ; H01L33/24

Abstract:
Provided are a light-emitting diode structure and a light-emitting diode manufacturing method. The light-emitting diode manufacturing method comprises the operations of:
preparing a lower substrate, which includes a substrate and a separation layer formed on the substrate, and preparing at least one semiconductor rod, which is formed on the separation layer, forming a rod structure, which includes a rod protecting layer formed on the separation layer to surround the at least one semiconductor rod and an auxiliary layer formed on at least part of the rod protecting layer and separating the rod structure from the lower substrate by removing the separation layer, and separating the at least one semiconductor rod from the rod structure.
preparing a lower substrate, which includes a substrate and a separation layer formed on the substrate, and preparing at least one semiconductor rod, which is formed on the separation layer, forming a rod structure, which includes a rod protecting layer formed on the separation layer to surround the at least one semiconductor rod and an auxiliary layer formed on at least part of the rod protecting layer and separating the rod structure from the lower substrate by removing the separation layer, and separating the at least one semiconductor rod from the rod structure.
Public/Granted literature
- US20220013693A1 LIGHT EMITTING ELEMENT STRUCTURE AND METHOD OF FABRICATING A LIGHT EMITTING ELEMENT Public/Granted day:2022-01-13
Information query
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