Invention Grant
- Patent Title: Slurry for forming electrode-active-material layer for cell
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Application No.: US16976373Application Date: 2019-07-18
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Publication No.: US11949104B2Publication Date: 2024-04-02
- Inventor: Akito Yamamoto
- Applicant: DAICEL CORPORATION
- Applicant Address: JP Osaka
- Assignee: DAICEL CORPORATION
- Current Assignee: DAICEL CORPORATION
- Current Assignee Address: JP Osaka
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Priority: JP 18137148 2018.07.20
- International Application: PCT/JP2019/028364 2019.07.18
- International Announcement: WO2020/017614A 2020.01.23
- Date entered country: 2020-08-27
- Main IPC: H01M4/62
- IPC: H01M4/62 ; H01M4/04 ; H01M4/36 ; H01M4/64

Abstract:
Provided is a slurry for forming an electrode-active-material layer, the slurry improving adhesion to a current collector while suppressing a decrease in cell capacity. The present invention provides a slurry for forming an electrode-active-material layer for a cell, the slurry including at least an active material and an aqueous binder, wherein the slurry has an aqueous binder content from 0.1 to 0.8 parts by weight based on 100 parts by weight of the active material, and a supernatant obtained by centrifuging the slurry has the aqueous binder content of 45% by weight or greater of a total amount of the aqueous binder contained in the slurry. The slurry of the present invention preferably further contains a fibrous material.
Public/Granted literature
- US20210376326A1 SLURRY FOR FORMING ELECTRODE-ACTIVE-MATERIAL LAYER FOR CELL Public/Granted day:2021-12-02
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