Invention Grant
- Patent Title: Integrated heatsink and antenna structure
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Application No.: US18086069Application Date: 2022-12-21
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Publication No.: US11949147B2Publication Date: 2024-04-02
- Inventor: Shaun Joseph Greaney , Michael Liccone , Michael Mirabella , Theodore Lubbe , Dave Doyle , Bob Migliorino , Perry Wintner , Clint Smith
- Applicant: VEEA Inc.
- Applicant Address: US NY New York
- Assignee: VEEA INC.
- Current Assignee: VEEA INC.
- Current Assignee Address: US NY New York
- Agency: THE MARBURY LAW GROUP, PLLC
- Main IPC: H01Q1/02
- IPC: H01Q1/02 ; H01Q1/44

Abstract:
An integrated heatsink and antenna structure that is suitable for inclusion in small and midsized computing devices. The integrated heatsink and antenna structure may include a plurality of fin components that dissipate thermal energy integrated into a heatsink base and a plurality of radio frequency antenna portions coupled to and surrounded by the fin components. The plurality of radio frequency antenna portions may form a monopole antenna. The heatsink base may operate as a ground reference for each of the plurality of the antenna portions and to improve an omnidirectional pattern of each of the plurality of the antenna portions.
Public/Granted literature
- US20230126145A1 Integrated Heatsink and Antenna Structure Public/Granted day:2023-04-27
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