Invention Grant
- Patent Title: High frequency and high power thin-film component
-
Application No.: US17676889Application Date: 2022-02-22
-
Publication No.: US11949169B2Publication Date: 2024-04-02
- Inventor: Cory Nelson , Gheorghe Korony
- Applicant: KYOCERA AVX Components Corporation
- Applicant Address: US SC Fountain Inn
- Assignee: KYOCERA AVX Components Corporation
- Current Assignee: KYOCERA AVX Components Corporation
- Current Assignee Address: US SC Fountain Inn
- Agency: Dority & Manning, P.A.
- Main IPC: H01Q1/22
- IPC: H01Q1/22 ; H01L27/08 ; H01L49/02 ; H01Q5/314

Abstract:
A resistive splitter can include a monolithic substrate and a patterned resistive layer formed over the monolithic substrate. The resistive splitter can include a first terminal, a second terminal, and a third terminal each connected with the patterned resistive layer. The resistive splitter can include at least one frequency compensating conductive layer formed over a portion of the patterned resistive layer. In some embodiments, the resistive splitter can exhibit a first insertion loss response between the first terminal and the second terminal that is greater than about −10 dB for frequencies ranging from about 0 GHz up to about 30 GHz.
Public/Granted literature
- US20220278453A1 High Frequency And High Power Thin-Film Component Public/Granted day:2022-09-01
Information query