Invention Grant
- Patent Title: Electromechanical assembly having integrated conductor
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Application No.: US17658344Application Date: 2022-04-07
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Publication No.: US11949216B2Publication Date: 2024-04-02
- Inventor: Channing P. Favreau , Alexander Gilbert , Thomas V. Sikina
- Applicant: Raytheon Company
- Applicant Address: US MA Waltham
- Assignee: Raytheon Company
- Current Assignee: Raytheon Company
- Current Assignee Address: US MA Tewksbury
- Agency: DALY, CROWLEY, MOFFORD & DURKEE, LLP
- Main IPC: H02G15/10
- IPC: H02G15/10 ; H05K5/02
Abstract:
Methods and apparatus for a housing assembly including a housing comprising a conductive material, a conductor extending through the housing, and a dielectric material at least partially surrounding the conductor. Portions of the housing may surround the conductor such that the conductor, the dielectric, and the portions of the housing form a channel through the housing.
Public/Granted literature
- US20230231371A1 ELECTROMECHANICAL ASSEMBLY HAVING INTEGRATED CONDUCTOR Public/Granted day:2023-07-20
Information query
