Invention Grant
- Patent Title: Multiple layer system, method of manufacture and saw device formed on the multiple layer system
-
Application No.: US16977753Application Date: 2019-02-04
-
Publication No.: US11949400B2Publication Date: 2024-04-02
- Inventor: Thomas Metzger , Yoshikazu Kihara , Thomas Pollard
- Applicant: RF360 SINGAPORE PTE. LTD.
- Applicant Address: SG Singapore
- Assignee: RF360 Singapore Pte. Ltd.
- Current Assignee: RF360 Singapore Pte. Ltd.
- Current Assignee Address: SG Singapore
- Agency: Patterson + Sheridan LLP
- Priority: DE 2018105290.1 2018.03.07
- International Application: PCT/EP2019/052623 2019.02.04
- International Announcement: WO2019/170334A 2019.09.12
- Date entered country: 2020-09-02
- Main IPC: H03H3/08
- IPC: H03H3/08 ; H01L41/08 ; H01L41/319 ; H03H9/02 ; H03H9/145 ; H03H9/25 ; H10N30/00 ; H10N30/079

Abstract:
A layer system especially for forming SAW devices thereon is proposed comprising a monocrystalline sapphire substrate having a first surface and a crystalline piezoelectric layer comprising MN, deposited onto the first surface, and having a second surface. As a first surface a crystallographic R-plane of sapphire is used enabling an orientation of c-axis of the piezoelectric layer parallel to the first and second surfaces.
Public/Granted literature
- US20210013862A1 MULTIPLE LAYER SYSTEM, METHOD OF MANUFACTURE AND SAW DEVICE FORMED ON THE MULTIPLE LAYER SYSTEM Public/Granted day:2021-01-14
Information query