Invention Grant
- Patent Title: Camera module and imaging apparatus including the same
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Application No.: US16844398Application Date: 2020-04-09
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Publication No.: US11949975B2Publication Date: 2024-04-02
- Inventor: Seunghak Lee , Gunwoo Ryu , Euncheol Lee , Hyunsu Jun
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Suwon-si
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Gyeonggi-do
- Agency: Harness, Dickey & Pierce, P.L.C.
- Priority: KR 20190075786 2019.06.25
- Main IPC: H04N23/57
- IPC: H04N23/57 ; H04N5/953 ; H04N23/40 ; H04N23/55

Abstract:
Provided are a camera module and an imaging apparatus including the same. The camera module includes a printed circuit board (PCB); a first imaging device on the PCB, the first imaging device configured to generate first image data based on a received optical signal; a second imaging device on the PCB, the second imaging device configured to generate second image data based on the received optical signal; a power management integrated circuit (PMIC) on the PCB, the PMIC configured to generate a plurality of power voltages based on an external power voltage received from an external power supply and provide the plurality of power voltages to the first imaging device and the second imaging device; and a connector configured to receive the external power voltage from the external power supply and provide the external power voltage to the PMIC.
Information query