Invention Grant
- Patent Title: Two-port SRAM cells with asymmetric M1 metalization
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Application No.: US17877317Application Date: 2022-07-29
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Publication No.: US11950401B2Publication Date: 2024-04-02
- Inventor: Jhon Jhy Liaw
- Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
- Applicant Address: TW Hsinchu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Current Assignee Address: TW Hsinchu
- Agency: Haynes and Boone, LLP
- Main IPC: H10B10/00
- IPC: H10B10/00 ; H01L27/092 ; H01L29/06 ; H01L29/417 ; H01L29/423 ; H01L29/78 ; H01L29/786

Abstract:
A semiconductor structure includes a substrate and an array of two-port (TP) SRAM cells. Each TP SRAM cell includes a write port and a read port. The array includes first and second TP SRAM cells. The write ports of the first and second TP SRAM cells abut each other. The write port of the first TP SRAM cell includes a first write pull-down (W_PD) transistor. The write port of the second TP SRAM cell includes a second W_PD transistor. The array of TP SRAM cells further includes a first source/drain contact landing on both a source/drain electrode of the first W_PD transistor and another source/drain electrode of the second W_PD transistor. The first TP SRAM cell includes a first Vss conductor located at a first metal layer. The first Vss conductor is directly above the first source/drain contact and connected to the first source/drain contact.
Public/Granted literature
- US20220384457A1 TWO-PORT SRAM CELLS WITH ASYMMETRIC M1 METALIZATION Public/Granted day:2022-12-01
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