Invention Grant
- Patent Title: Memory device for reducing thermal crosstalk
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Application No.: US17412345Application Date: 2021-08-26
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Publication No.: US11950434B2Publication Date: 2024-04-02
- Inventor: Yuan-Tai Tseng
- Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
- Applicant Address: TW Hsinchu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsinchu
- Agency: Eschweiler & Potashnik, LLC
- Main IPC: H10B63/00
- IPC: H10B63/00 ; H10N70/00 ; H10N70/20

Abstract:
The present disclosure relates to an integrated chip including a first word line and a second word line adjacent to the first word line. The first word line and the second word line both extend along a first direction. A first memory cell is over the first word line and a second memory cell is over the second word line. A first bit line extends over the first memory cell, over the second memory cell, and along a second direction transverse to the first direction. A first dielectric layer is arranged between the first memory cell and the second memory cell. The first dielectric layer extends in a first closed loop to form and enclose a first void within the first dielectric layer. The first void laterally separates the first memory cell from the second memory cell.
Public/Granted literature
- US20230064578A1 MEMORY DEVICE FOR REDUCING THERMAL CROSSTALK Public/Granted day:2023-03-02
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