Invention Grant
- Patent Title: Wire fixing structure and endoscope
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Application No.: US17096247Application Date: 2020-11-12
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Publication No.: US11950764B2Publication Date: 2024-04-09
- Inventor: Xiongwei Wang , Tsukasa Ota , Takuto Yoshinaga
- Applicant: OLYMPUS CORPORATION
- Applicant Address: JP Tokyo
- Assignee: OLYMPUS CORPORATION
- Current Assignee: OLYMPUS CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Scully, Scott, Murphy & Presser, P.C.
- Priority: JP 18122871 2018.06.28
- Main IPC: A61B1/005
- IPC: A61B1/005 ; A61B1/00

Abstract:
A wire fixing structure includes: a first hole portion through which a wire passes; and a second hole portion which is formed in a direction orthogonal to the first hole portion and communicates with the first hole portion. The wire includes: a first portion which is inserted into and is disposed in the first hole portion; a second portion which is extended from the first hole portion and wound around the outer peripheral portion of a wire fixing member; and a third portion which is inserted into and is disposed in the first hole portion again after the second portion is wound around the outer peripheral portion. The fastening member is inserted into the second hole portion and fixes the first portion and the third portion by pressing in the first hole portion.
Public/Granted literature
- US20210059506A1 WIRE FIXING STRUCTURE AND ENDOSCOPE Public/Granted day:2021-03-04
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