Invention Grant
- Patent Title: Clamping apparatus of injection molding machine
-
Application No.: US17391022Application Date: 2021-08-01
-
Publication No.: US11951665B2Publication Date: 2024-04-09
- Inventor: Koichi Yokoyama
- Applicant: Sodick Co., Ltd.
- Applicant Address: JP Kanagawa
- Assignee: Sodick Co., Ltd.
- Current Assignee: Sodick Co., Ltd.
- Current Assignee Address: JP Kanagawa
- Agency: JCIPRNET
- Priority: JP 20143401 2020.08.27
- Main IPC: B29C45/66
- IPC: B29C45/66

Abstract:
A clamping apparatus of an injection molding machine is provided. A first driving device operates a movable platen to perform mold opening/closing. A second driving device applies a clamping force to the movable platen. A screw mechanism converts rotational power of the driving devices into linear power. By contact/separation between a first rotation plate coupled to a screw shaft and a second rotation plate, a power transmission device switches transmission of power from the second driving device to the screw mechanism. At the normal time, an urging mechanism integrally moves the screw shaft and the first rotation plate in a mold closing direction and releases the connection of the second driving device. When the mold closing is completed, the urging mechanism allows the screw shaft and the first rotation plate to integrally move in a mold opening direction, and brings the second driving device into a connected state.
Public/Granted literature
- US20220063165A1 CLAMPING APPARATUS OF INJECTION MOLDING MACHINE Public/Granted day:2022-03-03
Information query