Invention Grant
- Patent Title: Binder compound and method for preparing same
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Application No.: US18381178Application Date: 2023-10-18
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Publication No.: US11952466B2Publication Date: 2024-04-09
- Inventor: Jianghui Lin , Yanjie Zhao , Xing Li , Haizu Jin
- Applicant: CONTEMPORARY AMPEREX TECHNOLOGY CO., LIMITED
- Applicant Address: CN Fujian
- Assignee: CONTEMPORARY AMPEREX TECHNOLOGY CO., LIMITED
- Current Assignee: CONTEMPORARY AMPEREX TECHNOLOGY CO., LIMITED
- Current Assignee Address: CN Ningde
- Agency: XSENSUS LLP
- Priority: CN 2111186129.2 2021.10.12
- Main IPC: C08G79/14
- IPC: C08G79/14 ; H01M4/62

Abstract:
The present application relates to a binder compound of formula (I), a method for preparing the same, and an electrode sheet comprising the same. In formula (I), R1, R2, and R3 each independently represents an unsubstituted or substituted linear or branched alkyl with 1-6 carbon atoms, or an unsubstituted or substituted aryl with 6-20 carbon atoms; R4 represents —COOM; R5 represents a bridging oxo or bridging imino; each M independently represents one of Li, Na, K, Rb, and Cs; Z represents a linear or branched alkylene with 1-6 carbon atoms; m is an integer selected from 7,600 to 47,000; n is an integer selected from 1,520 to 94,000; and m/n=0.1-10.
Public/Granted literature
- US20240052110A1 BINDER COMPOUND AND METHOD FOR PREPARING SAME Public/Granted day:2024-02-15
Information query