Invention Grant
- Patent Title: Electrically conductive composition, electrically conductive film, and laminate
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Application No.: US17026444Application Date: 2020-09-21
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Publication No.: US11952509B2Publication Date: 2024-04-09
- Inventor: Masashi Uzawa , Shinji Saiki , Akira Yamazaki
- Applicant: Mitsubishi Chemical Corporation
- Applicant Address: JP Tokyo
- Assignee: Mitsubishi Chemical Corporation
- Current Assignee: Mitsubishi Chemical Corporation
- Current Assignee Address: JP Tokyo
- Agency: Oblon, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP 18075578 2018.04.10
- Main IPC: C09D5/24
- IPC: C09D5/24 ; C08G73/02 ; C08K5/3415 ; C09D7/63 ; C09D7/65 ; C09D179/02 ; H01B1/12
Abstract:
The conductive composition of the present invention includes a conductive polymer (A) having an acidic group, and a basic compound (B) having a cyclic amide and an amino group in its molecule. The conductive film of the present invention is formed from the conductive composition. The laminate of the present invention includes a substrate; an electron beam resist layer, formed on at least one surface of the substrate; and a conductive film formed on the electron beam resist layer.
Public/Granted literature
- US20210009818A1 ELECTRICALLY CONDUCTIVE COMPOSITION, ELECTRICALLY CONDUCTIVE FILM, AND LAMINATE Public/Granted day:2021-01-14
Information query
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